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Technology | Technology Features
Technology Features
  • Well established fabs and processes with a broad range of features in the following processes: 0.5u, 0.35u, 180nm, 130nm and 90nm (deeper sub-microns are available too)

  • High performance libraries covering both high speed and low power requirements suitable for any FPGA/CPLD conversion

  • Up to multimillion gates supported

  • More than 512 Kbit DPRAM supported

  • Compatible with the latest and largest FPGA chips from vendors such as Altera and Xilinx

  • Drop-in ASIC: Full pin-to-pin compatible to the customer's FPGA Pin-Out

  • VDD, from 5V down to 1.5V

  • Support for commercial, industrial and military grades

  • I/O standards such as: TTL, CMOS, LVCMOS, GTL, PCI, LVDS, HSTL, LVPECL and more

  • Full ESD and latch-up protection for I/Os

  • Drive strength such as: 2mA, 4mA, 6mA, 12mA, 18mA, 24mA, 48mA

  • Multiple voltage support

  • Noise & EMC immunity features

  • Support for various types of special cells such as PLLs, DLLs, ADPLLs, multipliers, power-on-reset and a broad range of IPs

  • Assembly options: single die, multi die, stack-on, side by side and more

  • Packages support: SOIC, QFP, BGA, PGA, QFN, DIP and more

  • Full support for all DFT structures: Standards such as SCAN, JTAG, BIST and custom test structures according to the customer's request and/or design requirements

  • Full ATPG (Automatic Test Pattern Generation) support for DFT

  • Up to 500 MHz Clocks

  • Full system clocks synthesis tools

  • Mixed signal and custom analog cells support

Custom low power design for specific modules.