KaiSemi provides advanced multi-chip solutions, including the conversion of   several FPGAs into one ASIC in a way that immensely reduces the total system cost and power consumption.

In addition, we can package your EOL (End Of Life) ASIC or converted FPGA along with its external memories and other elements, thus enabling further cost reduction and a reduced PCB footprint.

Multi-chip merge is particularly beneficial for customers with stable systems which include several interconnected FPGAs. This solution reduces the total system cost, assembling complexity and power consumption to a fraction, while maintaining the original functionality.

All in all, we have both the ability to assemble multiple dies into a single package and the ability to convert multiple FPGAs into a single die.